On October 14, the 2026 Bay Area Semiconductor Industry Ecosystem Expo (referred to as the "Bay Core Expo") opened at the Shenzhen Convention and Exhibition Center (Futian). Companies including Hua Hai Qingke, Dianke Equipment, Weidao Nano, and Tuojing Technology showcased new equipment and advanced manufacturing processes, spanning key segments such as ion implantation, thin-film deposition, and advanced packaging and testing. A variety of innovative achievements were prominently displayed, providing a valuable window into the progress of semiconductor technology breakthroughs and their industrialization.

This edition of the Bay Chip Exhibition features an exhibition area of nearly 80,000 square meters, with over 1,000 exhibiting enterprises, complemented by more than 40 professional forums and over 30 supply-demand and investment/financing matchmaking events. Beyond its focus on new product launches, the exhibition also highlights how to integrate technological achievements into production lines and ensure their stable operation—a key priority for the industry.

Key equipment unveiled in a concentrated showcase; technological breakthroughs extend across multiple stages of the process

At the opening ceremony of the Bay Core Exhibition and the Semiconductor Industry Development Summit held on the 14th, Hua Hai Qingke unveiled the medium-current ion implantation machine iHQ-900E. Ion implantation is a critical process in semiconductor manufacturing, used to tune the electrical properties of semiconductor materials. According to the company, this equipment offers competitive advantages in areas such as implantation dose uniformity and angular control. Equipped with a self-developed software platform, the machine achieves a domestication rate of 95.6%, with the goal of achieving 100% domestication by 2027.

In the field of thin-film deposition, MicroGuide Nano has launched its iMagtron series of PVD magnetron sputtering equipment, along with a novel ruthenium (Ru) atomic layer deposition (ALD) process based on the iTomic MeT system. According to the company, this new process is designed to meet the requirements for fabricating ultra-thin continuous ruthenium films. With the introduction of these PVD products, the company's product portfolio now comprehensively covers three primary thin-film deposition technology pathways: ALD, CVD, and PVD.

At the exhibition, Tojing Technology unveiled its amorphous carbon thin-film deposition technology, Flowable Carbon. This technology has already been deployed in the NF-300M Supra-H equipment. By optimizing the precursor materials and process parameters, the company has developed two flowable carbon film deposition processes—Capi-Carbon and Sedi-Carbon—each offering distinct filling performance characteristics, thereby providing new process options for fabricating complex structures in advanced memory and logic chip manufacturing.

From ion implantation to thin-film deposition, domestic equipment manufacturers are expanding their product portfolio. Industry competition is no longer determined solely by specific technical specifications; it also depends on whether the equipment can be compatible with customers' process requirements, and whether it can balance stability, yield, and production costs over extended operational periods.

Growing demand for advanced packaging poses new challenges for dimensional inspection and thinning technologies

The growing demand for AI computing power is driving chip packaging toward directions such as high-density interconnects and heterogeneous integration. The increased adoption of complex structures—such as through-via glass (TGV) and rewire layers (RDL)—has imposed stricter requirements on defect detection, dimensional metrology, and process consistency.

At the opening ceremony, CETC Electronic Equipment Group Co., Ltd. unveiled the Venus 6 advanced packaging inspection and measurement system, designed for processes such as TGV and RDL. The system employs multimodal synchronous inspection integration technology and supports multi-process measurement and defect detection. The company also introduced a large-size silicon carbide (SiC) thinning solution. Its subsidiary, Beijing CETC Research & Development Co., Ltd., has already delivered an automated 8-inch SiC device wafer thinning machine to domestic wafer manufacturers for application. According to the test data provided by the company, the wafer can be consistently thinned to 120 μm, with the total thickness variation (TTV) within the wafer after grinding controlled within 3 μm.

Whether it is advanced packaging inspection or SiC processing, equipment innovation must be closely integrated with specific process conditions. Precision, cycle time, reliability, and cost together constitute the entry thresholds for equipment to be deployed in production lines, and also determine whether technological achievements can be sustainably scaled up for wider application.

From single-point innovation to systemic collaboration: beyond production line testing equipment, R&D and design tools are also evolving toward systematic, collaborative development. At the exhibition, Su Liqing, CEO of Qiyunfang, introduced the company's EDA system-level electronic design toolchain, which supports multi-stakeholder collaboration and unified management of R&D data. These solutions can shorten the electronic design cycle by 20% and increase the first-pass yield by 30%; however, these benefits still require validation under specific testing conditions and in real-world applications.

Data from the Ministry of Industry and Information Technology shows that from January to August this year, the national integrated circuit production volume reached 386 billion units, representing a year-on-year increase of 22.3%; during the same period, fixed asset investment in the electronic information manufacturing sector rose by 8.1% year-on-year. The growth in industrial production and investment has created market opportunities for the validation of new technologies, while also imposing higher requirements on equipment supply and process support systems.

Source: Economic Information Daily (supervised and hosted by Xinhua News Agency) / Reporter: Cheng Jing; Intern Reporter: Xiang Lijialu

Original link：2026 BayCore Exhibition: Semiconductor Technology Innovation Accelerates Its Transition Toward Industrialization

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