Backed by SMIC! China's first pan semiconductor intelligent manufacturing software stock rushes for Hong Kong IPO

release time:2026-07-06publisher:CSC

According to a report by Kuaijike on June 25, documents disclosed by the Hong Kong Stock Exchange show that Shanghai Gorui Li Software Co., Ltd. has officially passed the IPO hearing on the main board of the Hong Kong Stock Exchange. Guotai Haitong and Minyin Capital served as joint sponsors, while Semiconductor Manufacturing International Corporation (Smic) indirectly participated through its industrial fund.

According to the Frost & Sullivan 2025 report, based on revenue statistics, Golay ranks third in China's pan-semiconductor intelligent manufacturing software market, occupying approximately 12% of the market share. It is the first domestic manufacturer to cover the entire value chain in this field.

b85b5f91657f6e71d1ea10028dd2f60e_25155138199765.png

From a technical perspective, Golay's proprietary computer integrated manufacturing system has been implemented for the 12-inch wafer front-end 18-nanometer process automation solution across the entire factory, serving four core sectors: semiconductors, panels, PCBs, and photovoltaics.

Currently, Golily has accumulated over 340 industry customers in the pan-semiconductor field, including leading wafer manufacturing enterprises such as Semiconductor Manufacturing International Corporation (Smic). The two parties maintain a long-term and stable technical cooperation relationship in the field of intelligent upgrading of 12-inch production lines.

Financial data shows that from 2023 to 2025, Grelli's revenue was 165.5 million yuan, 248.9 million yuan, and 300.3 million yuan respectively, with a three-year compound growth rate of about 35%. The revenue from its intelligent manufacturing software business accounted for over 99% of the total.

Gorui Li has applied for listing under the special technology provisions of Chapter 18C of the Hong Kong Stock Exchange's main board listing rules. The funds raised will be primarily invested in core technology research and development areas such as the research and development of advanced process CIM systems, expansion into pan-semiconductor scenarios, and upgrading of commercialization capabilities.

2364fcc129341be1abfeaab729d84c49_25155138877766.png